ENERGY TECHNOLOGY

Brand Owner (click to sort) Address Description
ENER-TEC CIRCULAIR, INC. 1415 N. Dayton Street Chicago IL 60622 ENERGY TECHNOLOGY;portable electric heaters;
ENERTEC ENERTEC COMPANY, L.C. 11023 Washington Highway Glen Allen VA 23059 ENERGY TECHNOLOGY;design, marketing and sale of energy efficient heating and cooling systems;
ENERTEK U.S. ENERTEK, INC. 4901 EAST MAIN STREET FARMINGTON NM 87401 ENERGY TECHNOLOGY;OIL AND GAS PROCESSING AND PRODUCTION EQUIPMENT, NAMELY GAS DEHYDRATORS FOR THE REMOVAL OF WATER VAPOR FROM GAS, SEPARATORS USING HEAT AND MEANS OF CONTROLLING THE PRESSURE UNDER WHICH HYDROCARBONS ARE PROCESSED IN ORDER TO REMOVE FREE LIQUIDS FROM GAS AND SEPARATE LIQUIDS INTO WATER AND HYDROCARBON COMPONENTS, PROCESS HEATERS USING HEAT TO PREPARE A STREAM OF GAS SO THE STREAM WILL NOT FREEZE DURING PRESSURE REDUCTION, OIL TREATERS USING HEAT TO FACILITATE THE SEPARATION OF WATER FROM OIL, GAS PRODUCTION UNITS USING HEATERS AND SEPARATORS (AS ALREADY DESCRIBED) TO SEPARATE AND TRANSFER WATER FROM HYDROCARBONS AND TO CONTROL THE LOSS OF LIQUIDS AND GASES INTO THE ENVIRONMENT, AND STABILIZATION EQUIPMENT USING TEMPERATURE AND PRESSURE CONTROL TO PRODUCE STORED HYDROCARBONS THAT WILL REMAIN IN THE SAME PHYSICAL FORM IN WHICH THEY ENTERED THE STORAGE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention provides a method for inspecting a connecting surface of a flip chip to solve problems that the grinding, polishing and chemical etching method is used for making a sample. The present invention utilizes ion beam etching technology for making and processing a sample of the flip chip (FC). The ion beam etching technology includes two modes: keeping the energy of ion beam and increasing the etching time; and keeping the etching time and increasing the ion beam energy. The ion beam etching technology can remove a deforming portion between the solder ball and the metal pad, which is connected thereto because of the grinding and polishing. Specially, it is easy to analyse a sample of a scanning electron microscope (SEM) which includes an intermetallic compound formed between the solder ball and the metal pad connected thereto.