EPOXY RESIN

Brand Owner (click to sort) Address Description
A+ CLEAR DEEP POUR Minton, Kambria Lee 2710 Alpine Blvd. K113 2710 Alpine Blvd. K113 Alpine CA 91901 A PLUS CLEAR DEEP POUR;epoxy resin;
A+ CLEAR VIEW EPOXY RESIN Minton, Kambria Lee 2710 Alpine Blvd. K113 2710 Alpine Blvd. K113 Alpine CA 91901 A PLUS CLEAR VIEW EPOXY RESIN;epoxy Resin;
A+ CRAFTERS CHOICE TUMBLER EPOXY Minton, Kambria Lee 2710 Alpine Blvd. K113 2710 Alpine Blvd. K113 Alpine CA 91901 A PLUS CRAFTERS CHOICE TUMBLER EPOXY;Epoxy Resin;
COUNTER CULTURE DIY Brown, Barry 1901 E 35th ST Joplin MO 64804 Epoxy resin, Countertop kits, stains, concrete overlay, sealers;
EX-2000 COREPLAST FOX INDUSTRIES, INC. Baltimore MD Epoxy resin;
MSA BERRY PLASTICS CORPORATION 101 Oakley Street Evansville IN 47710 epoxy resin;
OSMOWELD OSMOSE, INC. 980 Ellicott Street Buffalo NY 14209 Epoxy Resin;
PURE 110+ THE BLACK & DECKER CORPORATION MR-045 701 E. Joppa Road Towson MD 21286 Epoxy resin; construction industry adhesives; industrial adhesives for masonry and concrete use;110+;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 ?m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.