Where the owner name is not linked, that owner no longer owns the brand
Technical Examples
Disclosed is a method for non-destructive removal of cured epoxy from a wafer backside. A wafer back-coated with epoxy is soaked in an acetone bath for a period of time, allowing degradation of the epoxy coating adhesion strength. The epoxy coating is then peeled or scraped away, leaving the wafer backside ready for a rework or for a reapplication of a new epoxy coating.