FLEXIBLE SUBSTRATE IMPREGNATED WITH THERMOPLASTIC

Brand	Owner (click to sort)	Address	Description
AEROPIPE	INFRASTRUCTURE TECHNOLOGIES	9317 PAPAYA PLACE FONTANA CA 92335	Flexible substrate impregnated with thermoplastic for use in repairing and reinforcing pipes;AERO PIPE;
AEROPIPE	SRT Holdings, Inc.	1740 Seven Oakes Rd., Suite 32 Escondido CA 92026	Flexible substrate impregnated with thermoplastic for use in repairing and reinforcing pipes;AERO PIPE;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A semiconductor package has a semiconductor device chip and a flexible substrate having a thermoplastic insulating resin layer. An electrode provided on the flexible substrate is connected to a predetermined electrode of the semiconductor device chip and sealed by the thermoplastic insulating resin layer. The flexible substrate is bent and provided with electrodes on the electrode-bearing and other surfaces. The flexible substrate has multi-layered wirings. Grooves or thin layer portions having a different number of wiring layers are formed at bends of the flexible substrate or regions including the bends, thereby creating a cavity at a portion in which a semiconductor device is packaged. Then, the flexible substrate is bent at predetermined positions to form a semiconductor package which does not depend on the outer dimensions of the semiconductor device chip.