FLIP CHIP BONDING MACHINES

Brand Owner (click to sort) Address Description
KATALYST Kulicke and Soffa Industries, Inc. 1005 Virginia Drive Fort Washington PA 19034 Flip chip bonding machines, flip chip placement machines, and die attach machines;CATALYST;
KATALYST Kulicke and Soffa Industries, Inc. 1005 Virginia Drive Fort Washington PA 19034 Flip chip bonding machines, flip chip placement machines, and die attach machines;CATALYST;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Pads to be used for flip chip bonding and wire bonding are pattern-formed on a surface of a substrate. The pads to be used for flip chip bonding are shielded. Plating is applied to each of the pads to be used for wire bonding. Bonding pads for wire bonding is shielded by a masking tape. An adhesive layer is applied to the surface of each of pads to be used for flip chip bonding. Solder powder is provided to adhere to the surface of each of pads to be used for flip chip bonding with the adhesive layer. The masking tape is peeled off from the bonding pads for wire bonding. The solder powder is melted by reflowing so that the solder covers the pads to be used for flip chip bonding.