FLOOR CLEANING POLISHING PREPARATIONS

Brand Owner (click to sort) Address Description
BUFFPAC PORTIONPAC CHEMICAL CORPORATION 901 Lake Street, #2190 Oak Park IL 60603 Floor cleaning and polishing preparations;
PREMIA S. C. Johnson & Son, Inc. 1525 Howe Street Racine WI 53403 floor cleaning and polishing preparations;
SOFIX Thompson-Siegel GmbH 230 Erkrather Strasse Dusseldorf Germany floor cleaning and polishing preparations;
SOFIX HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN(HENKEL KGAA) Henkelstrasse 67 D-40191 Duesseldorf Germany floor cleaning and polishing preparations;
TRIPOD ECOLAB INC. ESC/F7 370 Wabasha Street N. St. Paul MN 55102 floor cleaning and polishing preparations for commercial and institutional use;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.