FLUXING TUBES

Brand Owner (click to sort) Address Description
AIRCO AIRCO, INC. Montvale NJ FLUXING TUBES, FUEL ELEMENTS, MODERATORS, REFLECTORS, CONTROL RODS, THERMAL COLUMNS AND SHIELDING, ALL FOR NUCLEAR REACTORS; POTENTIOMETERS AND TRIMMERS; FLOW METERS; PRESSURE GAUGES AND PARTS; PRESSURE AND FLOW REGULATORS; TENSILE AND BENDING TESTING MACHINES; GAS PROPORTIONERS; IONIZATION GAUGES; GOGGLES, EYE SHIELDS, VISORS, OPTICAL FILTER AND PROTECTIVE LENSES, MAGNIFIER LENSES AS EYE PROTECTORS; FACE SHIELD USED IN WELDING AND SIMILAR OPERATIONS; THERMOCOUPLE GAUGES; GAS ANALYZERS; TOTALIZING GAS FLOW METERS; GAUGES; HYGROMETERS; MANOMETERS; PULSOMETERS; WEIGHT SCALES; THERMOMETERS; COMPUTERS; CONDUCTIVITY METERS; SPEED INDICATORS; AND TACHOMETERS;
AIRCO AIRCO, INC. Montvale NJ FLUXING TUBES, FUEL ELEMENTS, MODERATORS, REFLECTORS, CONTROL RODS, THERMAL COLUMNS AND SHIELDING, ALL FOR NUCLEAR REACTORS; POTENTIOMETERS AND TRIMMERS; FLOW METERS; PRESSURE GAUGES AND PARTS; PRESSURE AND FLOW REGULATORS; TENSILE AND BENDING TESTING MACHINES; GAS PROPORTIONERS; IONIZATION GAUGES; GOGGLES, EYE SHIELDS, VISORS, OPTICAL FILTER AND PROTECTIVE LENSES, MAGNIFIER LENSES AS EYE PROTECTORS; FACE SHIELDS USED IN WELDING AND SIMILAR OPERATIONS; THERMOCOUPLE GAUGES; GAS ANALYZERS; TOTALIZING GAS FLOW METERS; GAUGES; HYGROMETERS; MANOMETERS; PULSOMETERS; WEIGHT SCALES; THERMONETERS; COMPUTERS; CONDUCTIVITY METERS; SPEED INDICATORS; AND TACHOMETERS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.