GUM SHIELDS ATHLETIC USE

Brand	Owner	Address	Description
OPRO	OPRO INTERNATIONAL LIMITED	21 Bedford Square London WC1B3HH United Kingdom	Gum shields for athletic use; mouth guards for athletic use; mouth protectors for athletic use; mouth pieces for athletic use; gum shields for sports use; mouth guards for sports use; mouth protectors for sports use; and mouth pieces for sports use;Cleaning preparations; preparations for cleaning gum shields, mouthguards, mouth protectors and mouth pieces; and non-medicated products for mouth care, namely, tooth whitening preparations;Gum shields, mouthguards, mouth protectors and mouth pieces for use in the medical and dental fields; medical devices to prevent bruxism, grinding of teeth and snoring; dental devices to protect teeth from nighttime grinding and to prevent bruxism; dental bleaching trays used to bleach teeth;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Particle flaking is reduced in a semiconductor wafer processing apparatus by installing a chamber shield assembly in the chamber of the apparatus. The shield assembly includes a plurality of nested shields that are supported out of contact with each other and suspended such that, during thermal expansion and contraction, gaps are maintained that are sufficient to avoid arcing. Alignment structure on the shields and on the chamber walls force the shields to align concentrically and maintain the gaps. The shields are made of aluminum or another thermally conductive material and have cross-sectional areas large enough to provide high thermal conductivity throughout the shields. Mounting flanges and other mounting surfaces are provided on the shields that form intimate thermal contact with sufficient contacting area to insure high thermal conductivity from the shields to the temperature controlled walls of the chamber. Radiant lamps of an array are spaced around the chamber and extend vertically to expose multiple shields across large areas to heat for pre-heating bake-out of the shields and to eliminate thermal shock upon processing the first wafer of a run.