HEAT SPREADING DEVICES USE

Brand	Owner	Address	Description
ISOSAM	Novel Concepts, Inc.	613 Wildwood Avenue Birchwood Village MN 55110	HEAT SPREADING DEVICES FOR USE IN CONNECTION WITH A HEAT GENERATING SURFACE;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a plurality of die pads of an active surface, the semiconductor die being mounted on the device carrier. Connection means to electrically connect the die pads to the contact areas and a heat spreading means mounted on the active surface of the die are provided. The heat spreading means includes an upper plate and a foot ring which protrudes from a bottom surface of the upper plate and which is positioned between the die pads on the active surface such that a cavity is formed between the heat spreading means and the active surface. The cavity is filled with an adhering means interconnecting the heat spreading means and the active surface.