HEAT SINKS ELECTRONIC EQUIPMENT

Brand Owner (click to sort) Address Description
AQUAMAX R-THETA THERMAL SOLUTIONS INC. 6220 Kestrel Road Mississauga, Ontario L5T 1Y9 Canada heat sinks for electronic equipment, namely, heat sinks for use in power semiconductors; heat sinks for electronic equipment, namely, heat sinks for use in power electronics conversion equipment;AQUA MAX;
AQUASINK R-THETA THERMAL SOLUTIONS INC. 6220 Kestrel Road Mississauga, Ontario L5T 1Y9 Canada heat sinks for electronic equipment;
AQUASURF MERSEN CANADA TORONTO INC. 88 HORNER AVENUE TORONTO, ONTARIO M8Z5Y3 Canada heat sinks for electronic equipment, namely, heat sinks for use in power semiconductors; heat sinks for electronic equipment, namely, heat sinks for use in power electronics conversion equipment;AQUA SURF;
FABFIN MERSEN CANADA TORONTO INC. 88 HORNER AVENUE TORONTO, ONTARIO M8Z5Y3 Canada heat sinks for electronic equipment;fab fin;
FABFIN R-THETA INC. 6220 Kestrel Road Mississauga Ontario L5T 1Y9 Canada heat sinks for electronic equipment;fab fin;
R-THETA MERSEN CANADA MISSISSAUGA INC. 6220 KESTREL ROAD MISSISSAUGA, ONTARIO L5T1Y9 Canada heat sinks for electronic equipment;
R-THETA R-THETA, INC. 6220 Kestrel Road Mississauga, Ontario Canada heat sinks for electronic equipment;
RO R-THETA THERMAL SOLUTIONS INC. 6220 Kestrel Road Mississauga, Ontario L5T 1Y9 Canada heat sinks for electronic equipment;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10') mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.