HEAT SPREADING APPARATUS USE

Brand	Owner	Address	Description
ISOFILM	Novel Concepts, Inc.	613 Wildwood Avenue Birchwood Village MN 55110	HEAT SPREADING APPARATUS FOR USE IN CONNECTION WITH HEAT GENERATING SURFACES FOUND IN COMPUTERS, ELECTRICAL CONDUCTORS AND OTHER ELECTRONIC DEVICES;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a plurality of die pads of an active surface, the semiconductor die being mounted on the device carrier. Connection means to electrically connect the die pads to the contact areas and a heat spreading means mounted on the active surface of the die are provided. The heat spreading means includes an upper plate and a foot ring which protrudes from a bottom surface of the upper plate and which is positioned between the die pads on the active surface such that a cavity is formed between the heat spreading means and the active surface. The cavity is filled with an adhering means interconnecting the heat spreading means and the active surface.