HIGH DENSITY INTERCONNECT GRID ARRAYS

Brand	Owner	Address	Description
MICROCONTAK	TELEDYNE TECHNOLOGIES INCORPORATED	c/o David Zoetewey 1049 Camino Dos Rios Thousand Oaks CA 91360	High density interconnect grid arrays used in electrical circuits;MICRO CONTACT;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.