INDUSTRIAL ADHESIVES USE

Brand Owner (click to sort) Address Description
ADVANTRA ENCORE H.B. FULLER COMPANY WLB - Law - Trademarks 1200 Willow Lake Boulevard SAINT PAUL MN 551105101 Industrial adhesives for use in packaging applications;
ARMOR-MASK Scrima, Robert P.O. Box 530508 Henderson NV 89053 Industrial adhesives for use in coating and sealing;
CEASEFIRE United Innovative Solutions 1400 Progress Industrial Boulevard Lawrenceville GA 30043 Industrial adhesives for use in coating;
CHILDERS H.B. FULLER CONSTRUCTION PRODUCTS INC. WLB-Law-Trademark 1200 Willow Lake Blvd. Saint Paul MN 551105101 Industrial adhesives for use in coating and sealing; Industrial adhesives;
FOAM SHIELD Foamshield, Inc. 106 Scott Road PO Box 550 Eastanollee GA 30538 Industrial adhesives for use in coating to remove particulate matter;FOAM;
NOVUCEL MACRO Industries, Incorporated 1003 Putman Drive NW Huntsville AL 35816 Industrial adhesives for use in coating and sealing;
PENGUIN Sunstar, Inc. 3-1, Asahi-machi, Takatsuki-shi Osaka Japan industrial adhesives for use in the bonding or adhesion of various materials; namely, urethane form, rubber form , high forming polyethylene form, polypropylene cloth, glass wool, hemp felt, and various kinds of cloth, PVC leather, painted surfaces, and metals;
UVCONNECT TEKTRONIX, INC 14150 SW Karl Braun Drive Beaverton OR 97077 Industrial adhesives for use in the electronics test and measurement industry; Electrically conductive industrial adhesives for use in the electronics test and measurement industry; Industrial adhesives cured by ultraviolet light for use in the electronics test and measurement industry; Kit comprised primarily of industrial glue, industrial adhesives, non-conductive industrial adhesives, industrial adhesives cured by ultraviolet light, electrically conductive industrial adhesives, applicator tip, and battery powered curing light;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.