INSTRUMENTS MEASURING FLATNESS

Brand Owner Address Description
SFI SpeedFam-IPEC, Inc. 305 North 54th Street Chandler AZ 852262416 Instruments for measuring flatness and surface areas of solid materials surface treated by lapping machines, free-abrasive machines, abrading machines, grinding machines, honing machines, polishing machines, and chemical-mechanical polishing machines; and replacement parts for said instruments;Lapping machines, free-abrasive machines, abrading machines, grinding machines, honing machines, polishing machines, chemical-mechanical polishing and cleaning machines, cleaning machines and ultrasonic cleaning machines for cleaning solid materials surface treated by the aforesaid machines, machines for reclamation of deionized water used in slurries, automated loading and unloading machines; driving belts, ring gears, feed drives, return conveyors, mist extractors, washing stations, conveyors, and roller positioning arms for said machines; replacement parts for said goods; and machine parts - namely, discs, trays, turning boards, guide rails, workholder blanks, workplace carriers, precut pads, pressure pads, abrading pads, polishing pads, grinding stones, soft grinding stones, grinding wheels, and wheel dressers, for use in connection with said lapping machines, free-abrasive machines, abrading machines, grinding machines, honing machines, polishing machines, and chemical-mechanical polishing and cleaning machines;SPEED FAM IPEC;Abrasives particles and powders for use in connection with, and detergents and parts rinses for cleaning solid materials surface treated by, lapping machines, free abrasive machines abrading machines, grinding machines, honing machines, polishing machines, and chemical-mechanical polishing machines;Deionized water for use in preparing slurries containing abrasives, slurries containing abrasives and deionized water, slurries containing abrasives and chemicals and deionized water, and pad adhesives, for use in connection with lapping machines, free-abrasive machines, abrading machines, grinding machines, honing machines, polishing machines and chemical-mechanical polishing machines the purpose of said deionized water being to deliver said abrasives and chemicals to solid materials for surface treatment of said solid materials by said machines and the purpose of said pad adhesives being to attach precut pads, pressure pads, abrading pads, and polishing pads to said machines;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. There is disclosed a wafer flatness evaluation method includes measuring front and rear surface shapes of a wafer. The wafer front surface measured is divided into sites. Then, a flatness calculating method is selected according to a position of the site to be evaluated and flatness in the wafer surface is acquired.