INSULATING PROFILES INSULATING ELEMENTS

Brand Owner (click to sort) Address Description
I-STRUT TECHNOFORM CAPRANO + BRUNNHOFER GMBH Friedrichsplatz 8 34117 Kassel 00000 Germany INSULATING PROFILES AND INSULATING ELEMENTS, NAMELY WINDOW INSULTING PROFILES, DOOR INSULATING PROFILES, FACADE INSULATING PROFILES, WINDOW INSULATING ELEMENTS, DOOR INSULATING ELEMENTS AND FACADE INSULATING ELEMENTS FOR THE THERMAL SEPARATION OF METAL WINDOWS, FACADES AND DOORS;Color is not claimed as a feature of the mark.;
I-STRUT Technoform Caprano und; Brunnhofer GmbH& Co. KG Germaniastr. 14a 34119 Kassel Germany INSULATING PROFILES AND INSULATING ELEMENTS, NAMELY WINDOW INSULTING PROFILES, DOOR INSULATING PROFILES, FACADE INSULATING PROFILES, WINDOW INSULATING ELEMENTS, DOOR INSULATING ELEMENTS AND FACADE INSULATING ELEMENTS FOR THE THERMAL SEPARATION OF METAL WINDOWS, FACADES AND DOORS;Color is not claimed as a feature of the mark.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A semiconductor device includes a plurality of insulating layers laminated on a substrate to cover passive elements such as a capacitor, an inductor, and the like, and to fix an IC chip in a face up state in one of the insulating layers. The insulating layers have similar structures in each of which the passive element or the semiconductor chip is disposed in at the bottom, a plug is formed in the insulating layer to pass therethrough in the thickness direction for extending an electrode of one of these elements to the top surface, and a conductive layer is provided as wiring on the top surface of the insulating layer to be connected to the plugs for electrically connecting respective elements or rearranging the electrode position. Also, an insulating layer is provided on the top for protecting the semiconductor device and for providing an external connecting electrode.