INTEGRATED CIRCUIT MODULES USE

Brand Owner (click to sort) Address Description
MAGNESIUM SENSEEKER ENGINEERING INC. 100 Frederick Lopez Rd. Santa Barbara CA 93117 Integrated circuit modules for use with infrared detectors; Integrated circuits; Integrated circuits for use in the manufacture of infrared detectors; Integrated circuits, integrated circuit chips, and integrated circuit modules for digital video compression and decompression; Integrated circuits, integrated circuit chips, and integrated circuit modules for encoding and decoding digital video; Electronic integrated circuits; Large scale integrated circuits; Safety and driving assistant system for mobile vehicles and vessels comprised of electronic proximity sensors and switches, high-resolution cameras, integrated circuits for the purpose of imaging processing, and display monitors; Very large scale integration (VLSI) semiconductor integrated circuits;
NEON Senseeker Engineering Inc 100 Frederick Lopez Rd. Santa Barbara CA 93117 Integrated circuit modules for use with infrared detectors; Integrated circuits; Integrated circuits for use in the manufacture of infrared detectors; Integrated circuits, integrated circuit chips, and integrated circuit modules for digital video compression and decompression; Integrated circuits, integrated circuit chips, and integrated circuit modules for encoding and decoding digital video; Safety and driving assistant system for mobile vehicles and vessels comprised of electronic proximity sensors and switches, high-resolution cameras, integrated circuits for the purpose of imaging processing, and display monitors; Electronic integrated circuits; Large scale integrated circuits; Very large scale integration (VLSI) semiconductor integrated circuits;
OXYGEN SENSEEKER ENGINEERING INC. 100 Frederick Lopez Rd. Santa Barbara CA 93117 Integrated circuit modules for use with infrared detectors; Integrated circuits; Integrated circuits for use in the manufacture of infrared detectors; Integrated circuits, integrated circuit chips, and integrated circuit modules for digital video compression and decompression; Integrated circuits, integrated circuit chips, and integrated circuit modules for encoding and decoding digital video; Electronic integrated circuits; Large scale integrated circuits; Safety and driving assistant system for mobile vehicles and vessels comprised of electronic proximity sensors and switches, high-resolution cameras, integrated circuits for the purpose of imaging processing, and display monitors; Very large scale integration (VLSI) semiconductor integrated circuits;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention stacks integrated circuits into modules that conserve board surface area. In a two-high stack or module devised in accordance with a preferred embodiment of the present invention, a pair of integrated circuits is stacked, with one integrated circuit above the other. The two integrated circuits are connected with a pair of flexible circuit structures. Each of the pair of flexible circuit structures is partially wrapped about a respective opposite lateral edge of the lower integrated circuit of the module. The flex circuit pair connects the upper and lower integrated circuits and provides a thermal and electrical path connection path between the module and its application environment. The module has a bailout pattern with a different pitch and/or supplemental module contacts devised to allow combined signaling to the integrated circuits through contacts having a desired ballout footprint. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules provided for high-density memories or high capacity computing.