INTEGRATED CIRCUITS CHIP SETS

Brand	Owner (click to sort)	Address	Description
DIGITALCID	LUCENT TECHNOLOGIES INC.	600 Mountain Avenue Murray Hill NJ 07974	INTEGRATED CIRCUITS AND CHIP SETS;
SPEEDREACH	LSI Logic Corporation	1621 Barber Lane Milpitas CA 95035	INTEGRATED CIRCUITS AND CHIP SETS, NAMELY, ANALOG FRONT ENDS, DISCRETE MULTI-TONE ENGINES, LINE DRIVERS, AND NETWORKS PROCESSORS THAT WILL BE USED IN XDSL TECHNOLOGIES;SPEED REACH;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Wafer-level chip-scale packaging technology is used for improving performance or reducing size of integrated circuits by using metallization of pad-to-bump-out beams as part of the integrated circuit structure. Chip-scale packaging under bump metal is routed to increase the thickness of top metal of the integrated circuit, increasing current carrying capability and reducing resistance. An exemplary embodiment for a power MOSFET array integrated structure is described. Another exemplary embodiment illustrated the use of chip-scale processes for interconnecting discrete integrated circuits.