INTEGRATED CIRCUITS INDUSTRIAL COMMUNICATION

Brand Owner Address Description
MICROFIP Cegelec 13, rue Antonin Raynaud 92300 Levallois-Perret France integrated circuits for industrial communication networks;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.