INTEGRATED MICROPROCESSING CHIPS

Brand	Owner (click to sort)	Address	Description
CLEAREVRC	LUCENT TECHNOLOGIES INC.	600 Mountain Avenue Murray Hill NJ 07974	INTEGRATED MICROPROCESSING CHIPS;
EVRC PRO	LUCENT TECHNOLOGIES INC.	600 Mountain Avenue Murray Hill NJ 07974	INTEGRATED MICROPROCESSING CHIPS;EVRC;
EVRC+	LUCENT TECHNOLOGIES INC.	600 Mountain Avenue Murray Hill NJ 07974	INTEGRATED MICROPROCESSING CHIPS;
SYCHIP	SYCHIP, INC.	Suite 400 2805 North Dallas Parkway Plano TX 75093	INTEGRATED MICROPROCESSING CHIPS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.