INTEGRATED CIRCUITS IMPROVING VEHICLE

Brand Owner (click to sort) Address Description
DRAGONWORKS PERFORMANCE Jeffrey Munger 6312 Pablo Court Chino CA 91710 Integrated circuits for improving vehicle performance, namely, improving horsepower, torque, acceleration, turbo spool-up, fuel economy, and emissions; Computer chips; Automotive computer chips;DRAGON WORKS PERFORMANCE;PERFORMANCE;
SPITFIRE TUNING Jeffrey Munger 6312 Pablo Court Chino CA 91710 Integrated circuits for improving vehicle performance, namely, improving horsepower, torque, acceleration, turbo spool-up, fuel economy, and emissions; Computer chips; Automotive computer chips;TUNING;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Wafer-level chip-scale packaging technology is used for improving performance or reducing size of integrated circuits by using metallization of pad-to-bump-out beams as part of the integrated circuit structure. Chip-scale packaging under bump metal is routed to increase the thickness of top metal of the integrated circuit, increasing current carrying capability and reducing resistance. An exemplary embodiment for a power MOSFET array integrated structure is described. Another exemplary embodiment illustrated the use of chip-scale processes for interconnecting discrete integrated circuits.