INTEGRATED CIRCUITS USE WITH

Brand Owner (click to sort) Address Description
FOXICHIP Advanced Micro Devices, Inc. 2485 Augustine Drive Santa Clara CA 95054 integrated circuits for use with fiber optic links;FOXI-CHIP; FOXY CHIP;
GIGOPTIX GigOptix Suite 100 2400 Geng Rd Palo Alto CA 94303 Integrated circuits for use with optically connected communications and storage systems; high-precision electronic drivers and recievers for optical networks;GIG OPTIX;
GO GigOptix Suite 100 2400 Geng Rd Palo Alto CA 94303 Integrated circuits for use with optically connected communications and storage systems; high-precision electronic drivers and receivers for optical networks;GIG OPTIX;
SUPERNET Advanced Micro Devices, Inc. 2485 Augustine Drive Santa Clara CA 95054 integrated circuits for use with fiber optic networks;super net;
VAISHALI VAISHALI SEMICONDUCTOR 1300 WHITE OAKS ROAD CAMPBELL CA 95008 Integrated circuits for use with wide-area networks, local-area networks, and home networking data communications products; computer hardware; computer software, namely, software for use in the design of integrationed circuits; computer software, namely, software which provides communication over wide-area networks, local-area networks, and home networking data communications products;In the statement, Column 1, line 1, VIASHALI SEMICONDUCTOR, LLC should be deleted, and, VAISHALI SEMICONDUCTOR, LLC should be inserted.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.