KALE CHIPS

Brand Owner (click to sort) Address Description
AGGROPOPS Sustenance SG Pte. Ltd. 61 Ubi Avenue 1 #04-03 UB Point 408941 Singapore Kale chips; Vegetable chips;
CAL-SNAX Cal-Snax International 1455 W Fargo, Unit 2 Chicago IL 60626 Kale chips;
EARTHY KRUNCHY Earthy Krunchy Snacks 170 North Main Street, Unit B Middleton MA 01949 Kale chips;EARTHY CRUNCHY;On-line retail store services featuring kale chips;KRUNCHY;
HOOP SNACKS Roger Woods 106 Mathis Road Crystal Springs MS 39059 Kale chips; Low-fat potato chips; Plantain chips; Potato chips; Potato crisps and chips; Potato-based snack foods; Seasoned potato chips; Vegetable chips;SNACKS;
KALE POPPERS Cal-Snax International 1455 W Fargo, Unit 2 Chicago IL 60626 Kale chips;KALE;
ROOTED Rooted 3010 Madison Road Cincinnati OH 45202 Kale chips; Salads, except macaroni, rice, and pasta salad; Coconut yogurts; Guacamole; Soups; Dips; Nut-based milks for use as a milk substitute;
ROOTED JUICERY & KITCHEN Rooted 3010 Madison Road Cincinnati OH 45202 Kale chips; Salads, except macaroni, rice, and pasta salad; Coconut yogurts; Guacamole; Soups; Dips; Nut-based milks for use as a milk substitute;ROOTED JUICERY AND KITCHEN;JUICERY & KITCHEN;
VEGGIE CRUNCHERS Cal-Snax International 1455 W Fargo, Unit 2 Chicago IL 60626 Kale chips;
VEGGIE KALE POPPERS Cal-Snax International 1455 W Fargo, Unit 2 Chicago IL 60626 Kale chips;VEGGIE KALE;
VERMONT KALE CHIPS TriAmigos 1700 Cox Brook Road Northfield VT 05663 Kale chips;KALE CHIPS;
WHOLESOME HABIT N&N Group International 8229 Thoreau Ln Fort Worth TX 77479 Kale chips; Vegetable-based snack foods; Dehydrated fruit and vegetables snacks; Seed-based snack bars; Organic nut and seed-based snack bars; Snack food dips; Snack mix consisting of processed seeds;WHOLESOME;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requirements and some of the chips are thinned to insure that the chips requiring the lowest thermal resistance has the thinnest layer of a thermal adhesive or metal or solder interface between the chip and thermal spreader.