LAND MARK

Brand Owner (click to sort) Address Description
LANDMARK Rittenhouse Group, Inc., The 4067 North Lake Drive Milwaukee WI 53211 LAND MARK;business consulting services in the areas of advertising and marketing;
LANDMARK MEDIMETRIX GROUP, INC. 2424 North Federal Highway, Suite 100 Boca Raton FL 33431 LAND MARK;physician medical group services;
LANDMARK FRANKS, THOMAS C. 5300 Los Robles Drive Carlsbad CA 92008 LAND MARK;HOTEL SERVICES- NAMELY SALES AND MARKETING, ADVERTISING, PUBLIC RELATIONS, CONSULTING AND RESERVATION DELIVERY SERVICES TO HOTELS, RESORTS, CONDOMINIUMS, AND VACATION RENTAL COMPANIES IN THE HOTEL INDUSTRY;
LANDMARK Countrymark Cooperative, Inc 225 South East Street Suite 605 Indianapolis IN 46202 LAND MARK;agricultural advisory services; distributorship services in the field of grain and agricultural commodities; and retail store services for sale of petroleum products, animal and bird feed, agricultural seed, law and garden seed, agricultural and domestic fertilizer, and home and farm supplies;
LANDMARK LANDMARK GRAPHICS CORPORATION 3000 N. Sam Houston Pkwy. E. Houston TX 77032 LAND MARK;BUSINESS CONSULTATION SERVICES IN THE FIELD OF OIL AND GAS WELL DRILLING AND PRODUCTION;TECHNICAL SUPPORT SERVICES IN THE FIELD OF OIL AND GAS WELL DRILLING AND PRODUCTION, NAMELY, COMPUTER-AIDED EXPLORATION AND SEISMIC INTERPRETATION;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.