LARGE SCALE INTEGRATED CIRCUITS

Brand Owner (click to sort) Address Description
CEDS Silicon Works CO., LTD. 222, TECHNO 2-RO (TAMNIP-DONG) YUSEONG-GU, DAEJEON Republic of Korea large scale integrated circuits; semi-conductors; semiconductor elements; semiconductor wafers; electronic semi-conductors; electronic integrated circuits; electronic circuit boards; connectors for electronic circuits; integrated circuits; circuit boards provided with integrated circuits; integrated circuit modules; chips (integrated circuits); transistors; printed circuits; circuit boards;
CEDS+ Silicon Works CO., LTD. 222, TECHNO 2-RO (TAMNIP-DONG) YUSEONG-GU, DAEJEON Republic of Korea Large scale integrated circuits; integrated circuits for use in digital signal processors (DSP); semiconductor component; computer software for use in processing semiconductor wafers; semi-conductors; semiconductor elements; simulator for semiconductor; semiconductor wafers; electronic semi-conductors; electronic integrated circuits; electronic circuit board; connectors for electronic circuits; integrated circuits; circuit boards provided with integrated circuits; integrated circuit module; chips [integrated circuits]; transistors; printed circuits; circuit boards;CEDS PLUS;Color is not claimed as a feature of the mark.;
DECLOAK DeCloak Intelligences Co. 10F,No.22,Lane 35,Jihu Rd.,Neihu Dist. Taipei City 114 Taiwan Large scale integrated circuits; Logic circuits; Semiconductor chips; Microchips; Integrated circuits, integrated circuit chips, and integrated circuit modules for data processing; Microcircuits; Very large scale integration (VLSI) semiconductor integrated circuits; integrated circuits, integrated circuit chips, and integrated circuit modules for encoding and decoding; Electronic circuits; Electric and electronic circuits; Integrated circuits incorporating algorithms for use in data processing; Silicon chips; Semiconductors; integrated circuits; Downloadable and recorded software in the nature of a mobile application for use in data processing, data analysis, data de-identification, authenticating users, and privacy protection; semiconductor chips; Electronic components in the nature of semiconductors or integrated circuits; Dongles being computer hardware for preventing user's private data from being used or transferred; Integrated circuits and downloadable and recorded software containing security features for identification purposes, namely, integrated circuits and downloadable and recorded mobile application for use in data processing, data analysis, data de-identification, authenticating users, and privacy protection, all encoded with programming for user security protection features for identification purposes; computer chips; Integrated circuits that contain algorithm or software that can provide privacy protection specially adapted to electronic devices, namely, laptops, cell phones, personal digital assistants, gaming apparatus; downloadable algorithm software and downloadable and recorded software that can provide privacy protection specially adapted to electronic devices, namely, laptops, cell phones, personal digital assistants, gaming apparatus;
EXASPEED NTT Electronics Corporation 1-1-32, Shin-urashimacho, Japan Large scale integrated circuits;EXA SPEED;Color is not claimed as a feature of the mark.;
FERVID FAMILY FUJITSU SEMICONDUCTOR LIMITED 2-10-23 Shin-yokohama Kohoku-ku, Yokohama-shi Kanagawa 222-0033 Japan Large scale integrated circuits for radio frequency identification equipment featuring ferroelectric random access memory;FAMILY;
IPSILOS JVCKENWOOD Corporation 3-12, Moriya-cho, Kanagawa-ku, Yokohama-shi Kanagawa 221-0022 Japan Large scale integrated circuits;
LRLC Silicon Works CO., LTD. 222, TECHNO 2-RO (TAMNIP-DONG) YUSEONG-GU, DAEJEON Republic of Korea Large scale integrated circuits; integrated circuits for use in digital signal processors (DSP); semiconductor component, namely, chips and lead frames; computer software for use in processing semiconductor wafers; semi-conductors; semiconductor elements, namely, semiconductor power elements; simulator for semiconductor, namely, electronic machines to simulate tests of semiconductors; semiconductor wafers; electronic semi-conductors; electronic integrated circuits; electronic circuit board; connectors for electronic circuits; integrated circuits; circuit boards provided with integrated circuits; integrated circuit module; chips being integrated circuits; transistors; printed circuits; circuit boards;
NEUROMEM Norlitech 1150 Industrial Avenue Suite A Petaluma CA 94952 Large scale integrated circuits; Pattern recognition systems composed of computer chips, computer hardware and software; Solid state storage, namely, a nonvolatile storage medium that employs integrated circuits; Very large scale integration (VLSI) semiconductor integrated circuits;NEUROMEM; NEURON MEMORY;
REBELLIONS Rebellions Inc. 102-908, 239, Jeongjail-ro, Bundang-gu, Seongnam-si Gyeonggi-do Republic of Korea Large scale integrated circuits; semi-conductors; microchips; semiconductor devices; semi-conductor memory units; electronic control circuits; electronic circuits; integrated circuits; electronic semi-conductors; semiconductor component; semiconductor chipset; system-on-chip processors; artificial intelligence software;Research in the area of semiconductor processing technology; design of integrated circuits; research services relating to semiconductors; design of semiconductors or integrated circuits; design of semiconductors; design and testing of semiconductors; design of semiconductor chips; product research/custom design and testing for new product development regarding semiconductors;
SAPS Silicon Works CO., LTD. 222, TECHNO 2-RO (TAMNIP-DONG) YUSEONG-GU, DAEJEON Republic of Korea large scale integrated circuits; integrated circuits for use in digital signal processors (dsp); semiconductor component; computer software for use in processing semiconductor wafers; semi-conductors; semiconductor elements; simulator for semiconductor; semiconductor wafers; electronic semi-conductors; electronic integrated circuits; electronic circuit board; connectors for electronic circuits; integrated circuits; circuit boards provided with integrated circuits; integrated circuit module; chips (integrated circuits); transistors; printed circuits; circuit boards;
SENSIGHT Socionext Inc. 2-10-23, Shin-Yokohama, Kohoku-ku Yokohama-shi Kanagawa 222-0033 Japan Large Scale Integrated circuits; Large Scale Integrated circuits for processing images;SIN SIGHT;
SMARTCODEC FUJITSU SEMICONDUCTOR LIMITED 2-10-23 Shin-yokohama Kohoku-ku, Yokohama-shi Kanagawa 222-0033 Japan Large scale integrated circuits; image, sound and multimedia encoder and decoder;SMART CODE C;
SR SUPERIOR REALITY PANASONIC CORPORATION 1006 Oaza Kadoma, Kadoma-shi Osaka 571-8501 Japan Large scale integrated circuits;SUPERIOR;
SWING' NRINGER OKI SEMICONDUCTOR CO., LTD. 550-1 HIGASHIASAKAWA-CHO HACHIOJI-SHI, TOKYO 193-8550 Japan Large scale integrated circuits;SWING AND RINGER;
SWING' NRINGER OKI SEMICONDUCTOR CO., LTD. 550-1 HIGASHIASAKAWA-CHO HACHIOJI-SHI, TOKYO 193-8550 Japan Large scale integrated circuits;SWING AND RINGER;
SWING' NRINGER Oki Electric Industry Co., Ltd. 7-12 Toranomon 1-chome Minato-ku, Tokyo Japan Large scale integrated circuits;SWING AND RINGER;
SWING'NRINGER OKI SEMICONDUCTOR CO., LTD. 550-1 HIGASHIASAKAWA-CHO HACHIOJI-SHI, TOKYO 193-8550 Japan large scale integrated circuits;The design portion of the mark appears in blue. The word portion of the mark appears in black.;SWINGING RINGER;The colors blue and black are claimed as a feature of the mark.;
SWINGERRINGER OKI ELECTRIC INDUSTRY CO., LTD. 1-7-12 Toranomon Minato-ku, Tokyo 105-8460 Japan large scale integrated circuits;SWINGER RINGER;
THINE THine Electronics, Inc. 1-10-7 Hatchobori, Chuo-ku Tokyo 104-0032 Japan Large scale Integrated circuits;
TRICK PLAY PROCESSOR MITSUBISHI ELECTRIC CORPORATION 7-3 Marunouchi 2-chome Chiyoda-ku, Tokyo 100-8310 Japan large scale integrated circuits;PROCESSOR;
µLAPIS LAPIS SEMICONDUCTOR CO., LTD. 2-4-8 Shinyokohama, Kouhoku-ku Yokohama 222-8575 Japan large scale integrated circuits;Color is not claimed as a feature of the mark.;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. Wafer-level chip-scale packaging technology is used for improving performance or reducing size of integrated circuits by using metallization of pad-to-bump-out beams as part of the integrated circuit structure. Chip-scale packaging under bump metal is routed to increase the thickness of top metal of the integrated circuit, increasing current carrying capability and reducing resistance. An exemplary embodiment for a power MOSFET array integrated structure is described. Another exemplary embodiment illustrated the use of chip-scale processes for interconnecting discrete integrated circuits.