LAUNCHING HANDLING EQUIPMENT

Brand Owner Address Description
W WESTINGHOUSE ELECTRIC & MANUFACTURING COMPANY 4000 Town Center Boulevard, Suite 210 Canonsburg PA 15317 [ LAUNCHING AND HANDLING EQUIPMENT FOR MISSILES, SUCH AS ANTI-AIRCRAFT MISSILES ];In the statement, column 1, line 24, electric dishwashers, is deleted, and column 2, lines 5 through 9 are deleted.;[ ELECTRIC TOOTHBRUSHES ];[ NUMERICAL CONTROL MACHINE ];[ MAGNETIC TAPE RECORDERS ];[ ELECTRIC ELEVATORS, ELECTRIC ESCALATORS AND ELECTRIC MOVING WALKS ];[ GAS-FIRED MAKE-UP AIR UNITS, CENTRIFUGAL FANS AND PRESSURE BLOWERS AND ELECTRIC ARC HEATERS AND ARC WELDERS ];[ ELECTRIC HAIR DRYERS ];[ ELECTRICAL PORCELAIN, ELECTRICAL INSULATORS, CAPACITOR BUSHINGS, ] AC ROTATING ADJUSTABLE SPEED AND CONSTANT HORSEPOWER DRIVES, [ THYRISTOR STATIC ADJUSTABLE SPEED DRIVES USED TO PERFORM POWER CONVERSION, ELECTRIC ARC FURNACE ELECTRODES, ELECTRIC FLOOR POLISHERS AND ELECTRIC FLOOR SCRUBBERS FOR HOUSEHOLD AND OFFICE USE, ] ELECTRIC FOOD BLENDERS, ELECTRIC BROILER FRY PANS, ELECTRIC COFFEE MAKERS, ELECTRIC KNIVES, ELECTRIC HEATING PADS, ELECTRIC LAMP BALLASTS, AC TO DC POWER SUPPLY ADAPTED TO POWER A PLASMA CUTTING TORCH, DISCONNECT SWITCHES [ ELECTRIC DISHWASHERS, AND SILICON SEMICONDUCTOR DEVICES-NAMELY, SILICON RECTIFIER CELLS, SILICON DIODES, SILICON TRANSISTORS AND SILICON CONTROLLED RECTFIERS ];
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. Automated defect sourcing system identifies root-causes of yield excursion due to contamination, process faults, equipment failure and/or handling in timely manner and provides accurate timely feedback to address and contain the sources of yield excursion. A signature bank stores known wafer surface manufacturing defects as defect signatures. The signature of a manufacturing defect pattern is associated with a type of equipment or process, and used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature recognition engine matches wafer defects against the signature bank during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.