LOW POWER HIGH PERFORMANCE CHIPS

Brand	Owner	Address	Description
BIG LITTLE WIRELESS	Silicon Laboratories Inc.	400 W. CESAR CHAVEZ Austin TX 78701	Low Power High Performance chips, modules, and systems in the nature of system on a chip, integrated circuit chips, and integrated circuit modules for use with Multi-Protocol Wireless communications, namely Wireless Local Area Networks (WLAN) communication protocols, the series of 802.11 communication protocols, wireless and cellular communication protocols, and personal area networks communication protocols;WIRELESS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.