MACHINES ENCAPSULATION SEMICONDUCTOR

Brand	Owner (click to sort)	Address	Description
NEST	ASM Technology Singapore Ptd Ltd	2 Yishun Avenue 7 Singapore 768924 Singapore	machines for encapsulation of semiconductor devices; machines for plastic-molding of semiconductor devices;
PANELMOLD	TOWA CORPORATION	5, Kamitoba Kamichoshi-cho, Minami-ku Kyoto-shi, Kyoto Japan	Machines for encapsulation of semiconductor chips mounted on substrates with resin material;PANEL MOLD;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An efficient fabrication method of a SON type semiconductor device is to be provided. A plurality of linear leadframes is arranged side by side separately from each other. A plurality of semiconductor chips with a plurality of electrode pads is mounted over the plurality of the linear leadframes separately. The plurality of the electrode pads is joined to the plurality of linear leadframes with bonding wires. An encapsulation part for encapsulating the semiconductor chip and the bonding wires and an interframe encapsulation part for filling a space between the linear leadframes exposed outside the encapsulation part are formed. A groove part for cutting all the linear leadframes placed right under the semiconductor chip in the orthogonal direction with respect to the direction of extension of the linear leadframes is formed. The leadframes and the interframe encapsulation parts exposed between the plurality of semiconductor chips are cut to be separated into a semiconductor device.