MEME LAND

Brand Owner Address Description
MEMELAND 9GAG LIMITED Unit 1104, 11/F, Crawford House 70 Queen's Road Central Central Hong Kong MEME LAND;Issuance of tokens of value; Virtual currency dealing trading services; financial transaction services involving cryptocurrency, nonfungible tokens (NFTs) and blockchain technology, namely, providing secure commercial transactions and payment options;Administration of a customer loyalty program that provides rewards in the form of goods and services, digital assets, digital tokens, crypto-tokens, utility tokens, non-fungible tokens (NFTs), digital collectibles, crypto-collectibles, cryptocurrencies, digital currencies and virtual currencies; Online retail store services featuring virtual goods, digital content, non-fungible tokens used with blockchain technology to represent a collectible item; Providing an online searchable database featuring business information and business contacts for content creators and content providers; Online advertising and marketing services, featuring integrated marketing and digital content creation for advertising purposes; Online network matching or connecting creators in the nature of business intermediary services relating to the matching of potential private investors with entrepreneurs needing funding; provision of an online marketplace for buyers and sellers of goods and services; Provision of an online marketplace for buyers and sellers of digital goods authenticated by non-fungible tokens (NFTs); Provision of an online marketplace for displaying, registering, purchasing, selling, trading, or transferring digital assets, digital tokens, crypto-tokens, utility tokens, non-fungible tokens (NFTs), digital collectibles, crypto-collectibles, cryptocurrencies, digital currencies and virtual currencies;online network matching or connecting creators in the nature of social networking;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Disclosed are methods for facilitating concurrent formation of copper vias and memory element structures. The methods involve forming vias over metal lines and forming copper plugs, wherein the copper plugs comprise memory element film forming copper plugs (memE copper plugs) and non-memory element forming copper plugs (non-memE copper plugs), forming a tantalum-containing cap over an upper surface of non-memE copper plugs, and depositing memory element films. The tantalum-containing cap prevents the formation of the memory element films in the non-memE copper plugs. The subject invention advantageously facilitates cost-effective manufacturing of semiconductor devices.