MEMO PADS WITH SELF ADHESIVE

Brand Owner (click to sort) Address Description
DO NOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;NOTE;
EYE-IT CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;
EYENOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;EYE NOTE;
I-NOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;
KWIK-NOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;KWIK NOTE; QUICK NOTE;
LA NOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;NOTE;
LA PHOQUE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;The translation of the wording PHOQUE is seal.;
LA SEAL Sachen Chandaria P.O. Box 48020 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;
QUICK-NOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;QUICK NOTE;
Y-NOTE CHANDARIA, SACHEN P. O. Box 48870 Nairobi Kenya MEMO PADS WITH A SELF-ADHESIVE BACKING THEREON;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A semiconductor package comprises a chip having a top surface for chip pads and a bottom surface opposite the top surface. The top and bottom surfaces define side surfaces. The package further includes an adhesive layer provided within a chip-attaching area substantially defined by side surfaces of the chip and attaches a chip to, for example, a substrate having substrate pads. This prevents the contamination of the substrate pads by the adhesive layer. In one embodiment, the adhesive layer has at least one hole formed therethrough to expose a portion of the bottom surface of the chip. The adhesive layer may include at least one passage laterally connecting the hole to the outside. Alternatively, the adhesive layer has a plurality of adhesive parts separately disposed on the semiconductor chip.