METAL ALLOY USE

Brand Owner (click to sort) Address Description
ALLITE UWHK LIMITED Room 811, Hing Wai Centre No. 7, Tin Wan Praya Road Hong Kong Hong Kong Metal alloy for use in the manufacture of consumer products;
ALOLINE Wilson Walton International, Inc. 3349 Route 138, Building B, Suite B Wall NJ 07719 Metal Alloy for Use in Cathodic Protection Systems;ALLOY LINE;
ALOLINE Walton Associates, Inc. 77 River St. Hoboken NJ Metal Alloy for Use in Cathodic Protection Systems;
CASTIN AIM PRODUCTS, INC. 25 Kenney Drive Cranston RI 02920 metal alloy for use in lead free solder;
CASTIN AIM METALS & ALLOYS INC. 9100 HENRI BOURASSA BLVD. EAST MONTREAL, QUEBEC H1E2S4 Canada METAL ALLOY FOR USE IN LEAD FREE SOLDER;CAST IN;
CASTIN AIM PRODUCTS, INC. 25 Kenney Drive Cranston RI 02920 METAL ALLOY FOR USE IN LEAD-FREE SOLDER;
EVOLUTION IVOCLAR VIVADENT, INC. 175 Pineview Drive Amherst NY 14228 metal alloy for use in dentistry;
EVOLUTION IVOCLAR NORTH AMERICA INCORPORATED 175 Pineview Drive Amherst NY 141501777 metal alloy for use in dentistry;
IS IVOCLAR VIVADENT, INC. 175 Pineview Drive Amherst NY 14228 metal alloy for use in dentistry;
LAZALLOY United States Surgical Corporation 60 Middletown Avenue North Haven CT 06473 metal alloy for use in the manufacture of surgical devices;LAZ ALLOY;surgical sutures and surgical needles;
SURGALLOY COVIDIEN LP IP Legal 15 Hampshire Street Mansfield MA 02048 metal alloy for use in the manufacture of surgical devices;surgical sutures and needles;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A conductive connection forming method includes forming a first layer comprising a first metal on a substrate and forming a second layer comprising a second metal different from the first metal on the first layer. At least a part of the first layer may be transformed to an alloy material comprising the first and second metals. A conductive connection may be formed to the alloy material. The alloy material may be less susceptible to formation of metal oxide compared to the first metal. By way of example, transforming the first layer may comprise annealing the first and second layer. An exemplary first metal comprises copper, and an exemplary second metal comprises aluminum, titanium, palladium, magnesium, or two or more such metals. The alloy material may be an intermetallic. A conductive connection may be formed to the alloy layer. An integrated circuit includes a semiconductive substrate, a layer comprising a first metal over the substrate, and a layer of alloy material within the first metal comprising layer. The alloy material layer may comprise the first metal and a second metal different from the first metal. The alloy material may be an intermetallic. A conductive connection may be formed on the alloy layer.