METAL ALLOY

Brand Owner (click to sort) Address Description
13PLUS FORONI, S.p.A. Via A. Colombo 285 21055 Gorla Minore (VA) Italy metal alloy, namely austenitic/ferritic stainless steel;13 PLUS;
ARCONIUM A. J. OSTER COMPANY 400 HARRIS AVENUE PROVIDENCE RI METAL ALLOY;
CERROCAST MARMON ELECTRICAL & PLUMBING PRODUCTS-DISTRIBUTION, INC. 181 West Madison Street, 26th Floor Chicago IL 60602 METAL ALLOY, COMPOSED PRINCIPALLY OF BISMUTH AND TIN;
CERROCAST THE MARMON CORPORATION 25 W WASHINGTON ST CHICAGO IL 606063418 METAL ALLOY, COMPOSED PRINCIPALLY OF BISMUTH AND TIN;
CERROCAST CERRO DE PASCO CORPORATION 300 PARK AVE. NEW YORK NY 10020 METAL ALLOY, COMPOSED PRINCIPALLY OF BISMUTH AND TIN;
E-BRITE ATI PROPERTIES 1600 N.E. Old Salem Road Albany OR 97321 Metal Alloy;E BRIGHT;
MALLORY "1000" Automotive Balancing Service, Inc. 9624 Atlantic Ave. South Gate CA 90280 metal alloy;
MET-L-LOY Firestone Tire & Rubber Company, The Akron OH METAL-ALLOY;BRAKE LININGS;
MET-L-LOY/6 Firestone Tire & Rubber Company, The Akron OH METAL-ALLOY 6;BRAKE BLOCKS;
METALOY METAL ALLOY RECLAIMERS, INC. 197 ALPHA PARK HIGHLAND HEIGHTS OH 44143 METAL ALLOY;BROKERAGE SERVICES IN THE FIELD OF EQUILIBRIUM CATALYST MATERIAL FOR USE IN THE PETROLEUM CRACKING PROCESS;
METALOY METAL ALLOY RECLAIMERS, INC. METAL ALLOY RECLAIMERS, INC. 197 ALPHA PARK HIGHLAND HEIGHTS OH 44143 METAL ALLOY;BROKERAGE SERVICES IN THE FIELD OF EQUILIBRIUM CATALYST MATERIAL FOR USE IN THE PETROLEUM CRACKING PROCESS;METAL ALLOY RECLAIMERS, INC.;THE LINING IS A FEATURE OF THE MARK AND DOES NOT INDICATE COLOR.;
MP SPS TECHNOLOGIES, INC. Jenkintown PA METAL ALLOY;
MP159 SPS TECHNOLOGIES, INC. Jenkintown PA Metal Alloy;MP 159;
MULTIPHASE SPS TECHNOLOGIES, INC. Jenkintown PA METAL ALLOY;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A conductive connection forming method includes forming a first layer comprising a first metal on a substrate and forming a second layer comprising a second metal different from the first metal on the first layer. At least a part of the first layer may be transformed to an alloy material comprising the first and second metals. A conductive connection may be formed to the alloy material. The alloy material may be less susceptible to formation of metal oxide compared to the first metal. By way of example, transforming the first layer may comprise annealing the first and second layer. An exemplary first metal comprises copper, and an exemplary second metal comprises aluminum, titanium, palladium, magnesium, or two or more such metals. The alloy material may be an intermetallic. A conductive connection may be formed to the alloy layer. An integrated circuit includes a semiconductive substrate, a layer comprising a first metal over the substrate, and a layer of alloy material within the first metal comprising layer. The alloy material layer may comprise the first metal and a second metal different from the first metal. The alloy material may be an intermetallic. A conductive connection may be formed on the alloy layer.