METAL STENCILS USED INTEGRATED

Brand	Owner	Address	Description
ETCH GUARD	SYSCON INTERNATIONAL, INC.	1108 South High Street South Bend IN 46601	Metal stencils used for integrated circuit surface mount technology;ETCH;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method of reducing parasitic capacitance in an integrated circuit having three or more metal levels is described. The method comprises forming a bond pad at least partially exposed at the top surface of the integrated circuit, forming a metal pad on the metal level below the bond pad and forming an underlying metal pad on each of the one or more lower metal levels. In the illustrated embodiments, the ratio of an area of at least one of the underlying metal pads to the area of the bond pad is less than 30%. Parasitic capacitance is thus greatly reduced and signal propagation speeds improved.