METAL TREATMENT COMPRISED POLISHING

Brand Owner (click to sort) Address Description
M MAIN STEEL SAMUEL, SONE & CO. (USA) INC. 1401 DAVEY ROAD, SUITE 300 WOODRIDGE IL 60517 Metal treatment comprised of polishing, buffing, slitting, cutting-to-length, and application of protective film to stainless steel, nickel-based alloys, aluminum, carbon steel, titanium, brass, bronze, muntz, copper an other metals;PVC and polyethylene protective film for use in protecting metal surfaces;Color is not claimed as a feature of the mark.;STEEL;
M MAIN STEEL Main Steel 2200 Pratt Blvd Elk Grove Village IL 60007 Metal treatment comprised of polishing, buffing, slitting, cutting-to-length, and application of protective film to stainless steel, nickel-based alloys, aluminum, carbon steel, titanium, brass, bronze, muntz, copper an other metals;PVC and polyethylene protective film for use in protecting metal surfaces;Color is not claimed as a feature of the mark.;STEEL;
M MAIN STEEL Main Steel Polishing Company, Inc. 2 Hance Avenue Tinton Falls NJ 07724 Metal treatment comprised of polishing, buffing, slitting, cutting-to-length, and application of protective film to stainless steel, nickel-based alloys, aluminum, carbon steel, titanium, brass, bronze, muntz, copper an other metals;PVC and polyethylene protective film for use in protecting metal surfaces;Color is not claimed as a feature of the mark.;STEEL;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for producing a semiconductor device, polishing method, and polishing apparatus, suppressing occurrence of dishing and erosion in a flattening process by polishing of a metal film for constituting an interconnection of a semiconductor device having a multilayer interconnection structure. The production method includes the steps of: forming a passivation film exhibiting an action of inhibiting an electrolytic reaction of a metal at the surface of the metal film; selectively removing the passivation film on a projecting portion so as to expose the projecting portion of the metal film at the surface; removing the exposed projecting portion of the metal film by electrolytic polishing so as to flatten unevenness of the surface of the metal film; and removing the metal film present on an insulation film from the metal film with the flattened surface by electrolytic composite polishing combining electrolytic polishing and mechanical polishing so as to form an interconnection.