MICRO COMPUTER SYSTEMS

Brand Owner (click to sort) Address Description
ACCEL 900 MULTITECH ELECTRONICS, INC. 195 W. EL CAMINO REAL SUNNYVALE CA 94886 MICRO COMPUTER SYSTEMS;
EVENT Applied Data Communications 14272 Chambers Rd. Tustin CA 92680 Micro Computer Systems;
PLUS 700 MULTITECH ELECTRONICS, INC. 195 W. EL CAMINO REAL SUNNYVALE CA 94886 MICRO COMPUTER SYSTEMS;
TAURUS Taurus Computer Products Inc. 1755 Woodward Ave. Ottawa, Ontario K2C 0P9 Canada Micro Computer Systems, Comprised of Micro Processors, Timers, Communication Modules, Sensing Modules, Memory Modules, Input/Output Interfaces and/or Switching Modules for Data Acquisition and Control; Micro Processor, Input/Output Interconnect Modules; Inter Processor Communication Links for Use with Micro Processors;
TAURUS LAB Taurus Computer Products Inc. 1755 Woodward Ave. Ottawa, Ontario K2C 0P9 Canada Micro Computer Systems, Comprised of Micro Processors, Timers, Communication Modules, Sensing Modules, Memory Modules, Input/Output Intefaces and/or Switching Modules for Data Acquisition and Control; Micro Processor, Input/Output Interconnect Modules: Inter Processor Communication Links for Use with Micro Processors;No claim is made to the exclusive right to use Lab, apart from the mark as shown.;
TAURUS ONE Taurus Computer Products Inc. 1755 Woodward Ave. Ottawa, Ontario K2C 0P9 Canada Micro Computer Systems, Comprised of Micro Processors, Timers, Communication Modules, Sensing Modules, Memory Modules, Input/Output Interfaces and/or Switching Modules for Data Acquisition and Control; Micro Processor, Input/Output Interconnect Modules; Inter Processor Communication Links for Use with Micro Processors;
Z-NIX Z-NIX CO., INC. 9537 TELSTAR AVENUE, #121 EL MONTE CA 91731 MICRO COMPUTER SYSTEMS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method is described for closing openings in a film, for example, in microelectronic process technology, whereby substantially no deposition material passes through the openings, which can be important if fragile micro devices are positioned under the openings. The closure of these openings can cause an underlying cavity to be hermetically sealed, in which an object can be located. In particular the method provides a way for hermetically sealing cavities under controlled atmosphere and pressure in the encapsulation and sealing processes of cavities comprising fragile content. The cavities may comprise for example Micro Electro Mechanical Systems (MEMS). The method may be used for encapsulating devices which may require a controlled atmosphere and pressure encapsulation such as micro accelerometers, micro gyroscopes, micro tubes, vibration micro sensors, micro mirrors, micro mechanical resonators or "resonant strain gauges", micro mechanical filters, micro switches, micro electrical circuits, micro relays, Integrated Circuits with air gaps etc.