MICROELECTROINC COMPONENTS

Brand Owner (click to sort) Address Description
SI GE Atmel Germany GmbH Theresienstrasse 2 74072 Heilbronn Germany Microelectroinc components, namely, circuit boards, high frequency switches, amplifiers, power amplifiers, low noise amplifiers, and components for mobile phones; and semiconductor circuits;Color is not claimed as a feature of the mark.;
SI GE Atmel Germany GmbH Theresienstrasse 2 74072 Heilbronn Germany Microelectroinc components, namely, circuit boards, high frequency switches, amplifiers, power amplifiers, low noise amplifiers, and components for mobile phones; and semiconductor circuits;Color is not claimed as a feature of the mark.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer (2) on one of the components (1,4) and arranging the components (1,4) in spaced relationship with the intermediate layer (2) therebetween. The method further comprises heating one or both of the components (1,4) before bringing the components (1,4) into contact. Finally, a voltage is applied to the components (1,4) to create a permanent bond between the two components.