MICROELECTRONIC COMPONENTS

Brand Owner (click to sort) Address Description
SMART CUT S.O.I.TEC Silicon On Insulator Technologies Parc Technologique des Fontaines - Chemin des Franques F-38190 BERNIN France MICROELECTRONIC COMPONENTS, NAMELY, SEMICONDUCTOR SUBSTRATES AND WAFERS, FOR USE IN FLAT PANEL DISPLAYS, INTEGRATED OPTICAL WAVE GUIDES, SENSORS AND MICROMACHINERY DEVICES; SILICON WAFERS FOR USE IN MICROELECTRONICS DEVICES;In the statement, Column 1, lines 1-4, are deleted, and S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES ( FRANCE CORPORATION) PARC TECHNOLOGIQUE DES FONTAINES 38190 BERNIN, FRANCE should be inserted.;
TFK Atmel Germany GmbH Theresienstrasse 2 74072 Heilbronn Germany Microelectronic components, namely, electric and electronic circuits; integrated semiconductor circuits;
U-TAG Atmel Germany GmbH Theresienstrasse 2 74072 Heilbronn Germany MICROELECTRONIC COMPONENTS, NAMELY, LABELS, SEMICONDUCTOR CIRCUITS, INTEGRATED CIRCUITS, MICROPROCESSORS ELECTRONIC SYSTEMS COMPRISED OF DATA PROCESSORS AND INPUT AND OUTPUT PERIPHERALS, NAMELY, TRANSPONDER CIRCUITS WITH AND WITHOUT SENSORS TO MEASURE PHYSICAL PARAMETERS SUCH AS TEMPERATURE, HUMIDITY, WEIGHT, PRESSURE AND CONCENTRATION OF GAS AND FLUIDS;U TAG; YOU TAG;
USI Universal Scientific Industrial Co., Ltd. NO.141, LN. 351 SEC. 1, TAIPING RD., CAOTUN TOWNSHIP NANTOU COUNTY 54261 Taiwan microelectronic components; namely, thick film hybrid integrated circuits, resistor networks, crystal oscillators, input/output modules, and solid state relays; computer peripherals and parts for personal computers; namely, mother boards, add-on cards, and board assemblies;In the statement, Column 1, line 2, CHINA should be deleted, and, TAIWAN should be inserted.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present disclosure describes microfeature workpieces, microelectronic component packages, and methods of forming microelectronic components and microelectronic component packages. In one particular example, a microelectronic component package includes a substrate and a microelectronic component that has a first surface with a surface area greater than that of a second surface. A cementitious material, e.g., a die attach paste, may attach the second surface of the microelectronic component to a mounting surface of the substrate, with the cementitious material extending outwardly beyond a perimeter of the second surface and covering a surface area of the mounting surface that is no greater than the surface area of the first surface. Such a microelectronic component package may be formed with a smaller footprint or, alternatively, may include a microelectronic component having larger dimensions in a microelectronic component package of the same size.