MICROFLUIDIC INTEGRATED CIRCUITS THAT

Brand Owner (click to sort) Address Description
HUREL Hurel Corporation 8840 Wilshire Blvd Beverly Hills CA 90211 Microfluidic integrated circuits that can reveal interactions among various tissue types and pharmacologic compounds for scientific, laboratory and general research uses; flow cytometers providing cell and particle analysis, detection, and counting for scientific, laboratory, and general research uses; plates, glass slides and chips having multi-well arrays that can be used in chemical analysis, biological analysis and patterning for scientific, laboratory and medical research use;The wording Hurel has no meaning in a foreign language.;
HUREL Athena Capital Partners 8840 Wilshire Boulevard, 2nd Floor Beverly Hills CA 90211 Microfluidic integrated circuits that can reveal interactions among various tissue types and pharmacologic compounds for scientific, laboratory and general research uses; flow cytometers providing cell and particle analysis, detection, and counting for scientific, laboratory, and general research uses; plates, glass slides and chips having multi-well arrays that can be used in chemical analysis, biological analysis and patterning for scientific, laboratory and medical research use;The wording Hurel has no meaning in a foreign language.;
HµREL Hurel Corporation 8840 Wilshire Blvd Beverly Hills CA 90211 Microfluidic integrated circuits that can reveal interactions among various tissue types and pharmacologic compounds for scientific, laboratory and general research uses; flow cytometers providing cell and particle analysis, detection, and counting for scientific, laboratory and general research uses; plates, glass slides and chips having multi-well arrays that can be used in chemical analysis, biological analysis and patterning for scientific, laboratory and medical research use;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The invention provides a sealing layer that seals metal bonding structures between three dimensional bonded integrated circuits from a surrounding environment. A material may be applied to fill a volume between the bonded integrated circuits or seal the perimeter of the volume between the bonded integrated circuits. The material may be the same material as that used for underfilling the volume between the bottom integrated circuit and a substrate.