MICRON CLEAN UNIFORM

Brand	Owner	Address	Description
MICRON-CLEAN UNIFORM	CINTAS CORPORATION NO. 3	#117 250 Vista Boulevard Sparks NV 89434	MICRON CLEAN UNIFORM;UNIFORM;Garment rental, testing and packaging;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A polish method for planarization is disclosed. The method uses a combination of a traditional oxide CMP and HSP-CMP (High Selectivity and Planarization) with a fix abrasive pad to meet the requirements of the CMP process for a device feature dimension under 0.18 micron even to 0.09 micron. By using a first polish step with a conventional polish pad and an oxide polish slurry, the non-uniformity of the over-fill thickness of the STI dielectric layer can be firstly removed and a much more smooth and uniform topography favorable for the HSP-CMP process the fix abrasive polishing pad can be obtained. Then the HSP-CMP process with the fix abrasive polishing pad can be performed to provide a planarized surface with accurate dimension control.