MOLDING PLASTIC COMPONENTS

Brand Owner (click to sort) Address Description
CREATIVE MOLDING SOLUTIONS BATTS, INC. 200 Franklin Zeeland MI 494641000 molding of plastic components for commercial and industrial use;MOLDING SOLUTIONS;
PPD GROUPE PPD INC. 325 rue Principale N Waterville, Quebec J0B3H0 Canada Molding plastic components to the order and specification of others; manufacture of rubber raw material to order and/or specification of others;[Molded plastic wheel bearing and bushings, rotors and sleeves being part of machines];[Rubber raw material for use by others in manufacturing];[Molded plastic wheel bearings for vehicles];[Research and development of new products for others in the field of machinery for generating and manufacturing plastic materials, and in the field of molds for rubber and plastic];
PPD INC INDUSTRIES PPD INC. GROUPE PPD INC. 325 rue Principale N Waterville, Quebec J0B3H0 Canada molding plastic components to the order and specification of others;molded plastic wheel bearings and bushings, rotors and sleeves being parts of machines;molded plastic wheel bearings for vehicles;INC and INDUSTRIES;molded plastic casters;
PPD THERMOPLASTIC GROUPE PPD INC. 325 rue Principale N Waterville, Quebec J0B3H0 Canada molding plastic components to the order and specification of others in the fields of sport equipment, sport vehicles, automotive and mechanical parts;THERMOPLASTIC;
SMOOTHSKIN CONSOLIDATED METCO, INC. 5701 SE Columbia Way Vancouver WA 98661 MOLDING PLASTIC COMPONENTS TO THE ORDER AND SPECIFICATION OF OTHERS, AND CONSTRUCTING PLASTIC COMPONENT MOLDS TO THE ORDER AND SPECIFICATION OF OTHERS;
SMOOTHSKIN CONSOLIDATED METCO, INC. 5701 SE Columbia Way Vancouver WA 98661 molding plastic components to the order and specification of others and constructing plastic component molds to the order and specification of others;smooth skin;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The electronic component has a semiconductor chip embedded in a plastic compound. The electronic component is produced by first producing a number of electronic components on a panel and subsequent dicing into single electronic components. The semiconductor chip of this component is disposed on a substrate which includes or is entirely formed of plastic and is embedded in a plastic package molding compound. The plastic of the substrate has a glass transition temperature range which is lower than the glass transition temperature range of the plastic package molding compound.