OPTICAL READERS BALLS

Brand Owner Address Description
T-PECS ALSTOM Technology Ltd Brown Boveri Strasse 7 Baden CH-5400 Switzerland Optical readers for balls in heat exchangers; optical readers for measuring and inspecting balls in heat exchangers;Components for heat exchangers as machine parts, namely, vibratory screen separators;Units consisting of sponge rubber and corundum for cleaning heat exchangers and heat exchanger lines by means of hydraulically-driven solid bodies;Installation, upkeep, maintenance, repair and retrofitting of heat exchangers and their individual parts and accessories; cleaning of heat exchangers and heat exchanger lines by means of hydraulically-driven solid bodies, namely, balls and scrapers; outfitting in the nature of cleaning of heat exchangers and of their individual parts and accessories;Chemical ion-exchange resin membranes; and chemical preparations in the nature of filtering materials in cleaning of heat exchangers;Heat exchangers; units consisting of water debris filters and solid separators being structural parts for plate heat exchangers not being parts of machines; heat exchanger structural fittings, namely, metal conduits and separators for the cleaning and purification of liquids; solid separators for cleaning and purification of liquids in heat exchangers; water debris filters for machine heat exchanger and heat exchanger line cleaning units;Remote monitoring services of heat exchangers and their component parts; monitoring of heat exchangers and their individual parts and accessories;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.