OVER MOLDING MATERIALS ELECTRONICS

Brand Owner Address Description
MOLDMELT MOLDMAN SYSTEMS W129 N10825 Washington Drive GERMANTOWN WI 53022 over molding materials for electronics and electronics applications; custom manufacture of encapsulations and overmolds for electronics and electronics applications;MOLD MELT;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Highly ozone-resistant molding/shaped articles inclusive of piping materials and joints for use in semiconductor production lines, molding materials for ozone-resistant molding/shaped articles which are suited for the production of the molding/shaped articles, and ozone-resistant injection-molded articles and relevant injection-molding materials. Also disclosed is a molding material for ozone-resistant molding/shaped articles including a copolymer (A) and having a melt flow rate of 0.1-50 g/10 minute. The copolymer (A) is a copolymer including tetrafluoroethylene and a perfluorovinylether, and has not less than 3.5 mass % of a perfluorovinylether unit, a melting point of not less than 295° C., and not more than 50 of unstable terminal groups per 1×10