OXYGEN CONCENTRATORS MEDICAL USE

Brand Owner (click to sort) Address Description
ADVANCED TECHNOLOGY FRACTIONATOR DYNOTEC, INC. 6665 Nancy Ridge Drive San Diego CA 92121 oxygen concentrators for medical use, including valves for oxygen concentrators and sieve bed arrays for oxygen concentrators;FRACTIONATOR;
ATF CAIRE INC. 2200 Airport Industrial Dr., Ste. 500 Ball Ground GA 30107 oxygen concentrators for medical use, including valves for oxygen concentrators and sieve bed arrays for oxygen concentrators;
ATF CHART SEQUAL TECHNOLOGIES INC. Suite 300 One Infinity Corporate Centre Drive Garfield Heights OH 44125 oxygen concentrators for medical use, including valves for oxygen concentrators and sieve bed arrays for oxygen concentrators;
ATF SEQUAL TECHNOLOGIES 11436 SORRENTO VALLEY ROAD SAN DIEGO CA 92121 oxygen concentrators for medical use, including valves for oxygen concentrators and sieve bed arrays for oxygen concentrators;
INOGEN INOGEN, INC. 301 Coromar Dr. Goleta CA 93117 Oxygen concentrators for medical use; oxygen concentrators for use by patients suffering from chronic obstructive pulmonary disease (COPD) and other respiratory disorders; oxygen monitors for medical use; nasal interfaces for medical purposes; medical tubing connectors; patient breathing system comprising a breathing circuit and connections to patient;
KEYSTONE DEVILBISS HEALTH CARE, INC. oxygen concentrators for medical use and parts therefor; namely, replacement sieve beds, replacement compressors, replacement valves and replacement micro processor boards;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of fabricating a MEMS device includes forming a magnetic sensor over a SOI wafer which may include an epoxy layer; forming a pair of MEMS flux concentrators sandwiching the magnetic sensor; connecting an electrostatic comb drive to each of the flux concentrators; connecting a spring to the flux concentrators and the comb drive; performing a plurality of DRIE processes on the SOI wafer; and releasing the flux concentrators, the comb drive, and the spring from the SOI wafer. Another embodiment includes forming adhesive bumps and a magnetic sensor on a first wafer; forming a second wafer; forming a pair of MEMS flux concentrators, a pair of electrostatic comb drives, and at least one spring on the second wafer; bonding the second wafer to the adhesive bumps; and compressing the adhesive bumps using non-thermal means such as pressure only.