PACKAGED COMBINATION CONSISTING PRIMARILY

Brand Owner (click to sort) Address Description
CRACKER CRUNCHERS JONMOR INVESTMENTS, INC. 3411 Silverside Road 3411 Silverside Road, Baynard Bldg. 103 Wilmington DE 19810 Packaged combination consisting primarily of meat and cheese with crackers;CRACKER;
LOCO NACHOS JONMOR INVESTMENTS, INC. 3411 Silverside Road 3411 Silverside Road, Baynard Bldg. 103 Wilmington DE 19810 Packaged combination consisting primarily of corn tortilla chips, salsa and cheese;NACHOS;
LUNCH IS WHAT YOU MAKE OF IT OSCAR MAYER FOODS CORPORATION P.O. BOX 7188 MADISON WI 53707 packaged combination consisting primarily of crackers, candy, bakery goods, puddings, candy bars, brownies with meat, cheese and trail mix comprised of candy, processed nuts, processed cereal, processed fruit and candy;PACKAGED COMBINATION CONSISTING PRIMARILY OF MEAT, CHEESE AND TRAIL MIX COMPRISED OF PROCESSED NUTS, PROCESSED CEREAL, PROCESSED FRUIT AND CANDY WITH CRACKERS, BROWNIES, CANDY BARS, BAKERY GOODS AND PUDDING;
LUNCH MAKERS JONMOR INVESTMENTS, INC. 3411 Silverside Road 3411 Silverside Road, Baynard Bldg. 103 Wilmington DE 19810 packaged combination consisting primarily of meat and cheese with crackers;LUNCH;
LUNCHMAKERS JONMOR INVESTMENTS, INC. 3411 Silverside Road 3411 Silverside Road, Baynard Bldg. 103 Wilmington DE 19810 packaged combination consisting primarily of tortilla chips, salsa and dip;
SNACKMAKERS JONMOR INVESTMENTS, INC. 3411 Silverside Road 3411 Silverside Road, Baynard Bldg. 103 Wilmington DE 19810 packaged combination consisting primarily of meat and cheese with crackers;SNACK MAKERS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A VCSEL die is packaged so that its optical axis is at a predetermined non-perpendicular and nonparallel angle relative to the plane of a PCB to which the packaged die will be mounted. The die is packaged to form an emitting component which is shaped to orient the VCSEL optical axis at the predetermined angle when the component is placed onto a PCB. The component can be used in combination with a flip-chip sensor IC located on an opposite side of a PCB from the emitting component. The component can also be used in combination with a CSP sensor IC on the same side of a PCB. A VCSEL die and sensor IC can be contained in a single package. The optical axis of the VCSEL die packaged with a sensor IC may or may not be perpendicular to a plane of an array in the sensor IC.