PADS PLASTERS FOR CORNS

Brand Owner (click to sort) Address Description
SET BACK SCHOLL MFG. CO., INC., THE 213 WEST SCHILLER STREET CHICAGO IL PADS AND PLASTERS FOR CORNS, BUNIONS, AND CALLI;
ZINO SCHOLL, INC. Chicago IL PADS AND PLASTERS FOR CORNS, BUNIONS, AND CALLI;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.