PILATES TONING BALLS

Brand Owner (click to sort) Address Description
GOOD MANTRA Nicole Spence Entertainment 770 Hurole NE Palm Bay FL 32907 Pilates toning balls; Resistance bands for fitness purposes; Yoga blocks; Fitness equipment, namely, straps used for yoga and other fitness activities and for carrying a yoga mat;Fruit juices; Fruit juices and fruit drinks; Vegetable juice beverages, non-alcoholic; Vegetable juices; Green vegetable juice beverages; Mixed fruit juices; Vegetable-fruit juices;
LIFEFIT Stryker Enterprise 8930 Carmel Grove Lane Richmond TX 77407 Pilates toning balls; Yoga boards; Yoga cushions; Yoga straps; Exercise equipment in the nature of resistance bands; Exercise equipment, namely, shoulder stretcher using resistance cables; Fitness equipment, namely, straps used for yoga and other fitness activities and for carrying a yoga mat; Physical fitness equipment, namely, resistance bands; Stretch bands used for yoga and physical fitness purposes;LIFE FIT;
MICROGO Shenzhenshi Weigo Jiaju Youxiangongsi Longhuajiedao Gongyexilu 88Hao LHSWZX302 Longhua Qu,Shenzhen 518110 China Pilates toning balls; Yoga blankets; Yoga blocks; Yoga boards; Yoga bolsters; Yoga cushions; Yoga gloves; Yoga straps; Yoga swings; Fitness equipment, namely, straps used for yoga and other fitness activities and for carrying a yoga mat; Stretch bands used for yoga and physical fitness purposes;MICRO GO;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.