PLASMA ETCHING MACHINES USED

Brand Owner Address Description
OMEGA SPP PROCESS TECHNOLOGY SYSTEMS UK LIMITED C/O SURFACE TECHNOLOGY SYSTEMS PLC, IMPERIAL, PARK, NEWPORT, WALES NP10 8UJ United Kingdom plasma etching machines used in the fabrication of semiconductor and dielectric material devices;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. An apparatus and method are described for etching Ni-containing films using gas phase plasma etching. Etching of Ti-Ni alloys is carried out by exposure to plasma comprising hydrogen halide (HX) and carbonyl etching gases. The Ti in the Ti-Ni alloy is etched via an ion-assisted reaction with HX and the Ni is etched by reacting with CO. The method is particularly well suited for anisotropic etching of Ti-Ni metal gates for CMOS applications. Etching of Ni-Fe layers is carried out by exposure to plasma comprising a carbonyl etching gas.