POLISHING PADS POLISHING MACHINES

Brand	Owner (click to sort)	Address	Description
ENCORE	Cabot Microelectronics Corporation	870 North Commons Drive Aurora IL 60504	Polishing pads for polishing machines, primarily for use in the semiconductor and electronic industries;
EPIC	CMC MATERIALS, INC.	870 N. Commons Drive Aurora IL 60504	Polishing Pads for Polishing Machines, Primarily for Use in the Semiconductor and Electronic Industries;
EPIC POWER	CMC MATERIALS, INC.	870 N. Commons Drive Aurora IL 60504	Polishing pads for polishing machines for use in the manufacture of integrated circuit wafers, semiconductor wafers, integrated circuits, hard disk drives and chipsets; Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of integrated circuit wafers, semiconductor wafers, integrated circuits, hard disk drives and chipsets;
GO	CABOT MICROELECRONICS CORPORATION	870 N. COMMONS DRIVE AURORA IL 60504	Polishing pads for polishing machines, primarily for use in the semiconductor and electronic industries;
J.H. RHODES	JH RHODES COMPANY, INC.	Suite 675 2800 North 44th Street Phoenix AZ 85008	polishing pads for polishing machines for polishing substrates;The name J.H. RHODES does not identify a living individual.;

MEDEA	CMC MATERIALS, INC.	870 N. Commons Drive Aurora IL 60504	Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets;
NEOPAD	Neopad Technologies Corporation	1290 Oakmead Parkway, Suite 305 Sunnyvale CA 940854045	Polishing pads for polishing machines for use in the manufacture of semiconductor wafers;
NEXPLANAR	CMC MATERIALS, INC.	870 N. Commons Drive Aurora IL 60504	polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets;NEXT PLANNER;
NEXPLANAR	NEXPLANAR CORPORATION	7175 NW Evergreen Parkway, Suite 200 HILLSBORO OR 97124	polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets;NEXT PLANNER;
NEXPLANAR	Neopad Technologies Corporation	1290 Oakmead Parkway, Suite 305 Sunnyvale CA 940854045	polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets;NEXT PLANNER;
WSP	JSR CORPORATION	9-2, Higashi-Shinbashi 1-chome Minato-ku, Tokyo 105-8640 Japan	Polishing pads for polishing machines for use in the manufacture of semiconductor wafers;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.