Where the owner name is not linked, that owner no longer owns the brand
Technical Examples
A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly formed, for generating a dynamic pressure by rotation; a polishing table to which the polishing pad is adhered; a wafer provided at a predetermined interval from the polishing pad; a polishing head, on which the wafer is mounted, for driving the wafer; and a slurry supplier for providing slurry to a surface of the polishing pad.