POLYMER SURFACE PROTECTIVE FILM

Brand Owner Address Description
BIOSTAT Ridge Corporation 1201 Etna Parkway Pataskala OH 43062 Polymer surface protective film for use in commercial or industrial applications for application upon structural panels; Polymer surface protective film for cargo containers; Adhesive polymer film on structural panels for use in commercial or industrial manufacturing; Adhesive polymer protective film for cargo containers in the passenger, cargo, transit and rail trains industries, including for use in buses, transit coaches, delivery trucks, vans, cargo containers; Insulating structural panels for use in home construction, commercial construction, aircraft, trailers, rail cars, boats, ships, architectural, noise abatement, cargo containers and other residential, commercial and industrial uses; insulating thermoplastic composite glass sheets used as interior wall liners in cargo areas of trailers, railroad cars, cargo trucks and delivery trucks and vans;Vehicle parts, namely, interior freight wall liners for cargo containing area of vehicles; walk-in trailers and motor homes; structural parts being interior wall liners for cargo areas of trailers, railroad cars, cargo trucks, and delivery trucks and vans, made of thermoplastic composite glass sheets;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A process for producing semiconductor chips having a protective film on the back surface includes the steps of: providing a sheet to form the protective film having a release sheet and a protective film-forming layer formed on a detachable surface of the release sheet, wherein the protective film-forming layer includes a thermosetting component, an energy ray-curable component and a binder polymer component; adhering a protective film-forming layer of the sheet to form the protective film onto a back surface of a semiconductor wafer having circuits on its surface; curing the protective film-forming layer by irradiation with an energy ray, and thereafter, further conducting the additional steps of (in any order): detaching the release sheet from the protective film-forming layer; further curing the protective film-forming layer by heating; and dicing the semiconductor wafer together with the protective film-forming layer with respect to each circuit.