PRE FABRICATED GREENHOUSES NOT METAL

Brand Owner (click to sort) Address Description
BRIDGELAND Zhejiang Focus-On Import & Export Co., Ltd. 40 F Intime Centre 1600 Kejiguan Street, Binjiang District Hangzhou 310052 China Pre-fabricated greenhouses not of metal;Electrical tape; Duct tape;Adhesive packing tape for stationery or household use;BRIDGE LAND;Unfitted tarps for household use in the nature of tarpaulins;Back scratchers; dusters on telescopic handles; Fly swatters; Dust pans; Work gloves; Garden hose sprayer;
CALIFORNIA GREENHOUSE Jerald Roy Simpson 3191 Marengo Ave. Altadena CA 91001 Pre-fabricated greenhouses not of metal;
EASY GREEN GREENHOUSES AND SUPPLIES Jerald Roy Simpson 3191 Marengo Ave. Altadena CA 91001 Pre-fabricated greenhouses not of metal;
PPOD Ponix MicroAg 4A 70 W 95th Street New York NY 10025 Pre-fabricated greenhouses not of metal;
PPOD Wark, Christopher G 70 W 95th Street #4A New York NY 10025 Pre-fabricated greenhouses not of metal;
WILDERNESTS Wildernests Unit A 108 Park Place Los Angeles CA 90291 Pre-fabricated greenhouses not of metal; Pre-fabricated non-metal homes; Manufactured housing, namely, mobile homes;Pre-fabricated houses of metal;WILDER NESTS;
WIREGRASS RC&D TUNNEL HOUSE Wiregrass Resource Conservation and Development Project, Inc. 211 North Union Avenue Ozark AL 36360 Pre-fabricated greenhouses not of metal sold in kit form;WIREGRASS RC AND D TUNNEL HOUSE;HOUSE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of protecting metal traces and contacts on a fabricated semiconductor wafer from mechanical damage during dicing of the fabricated wafer, where the metal traces and contacts form electrical connections with an active device region of the semiconductor. The method includes the steps of providing a group of discrete metal deposits adjacent the metal traces and contacts, wherein said metal deposits are substantially not contiguously connected to each other or to any traces or contacts of the active device regions of semiconductor die, attaching the fabricated wafer to an adhesive tape used for securing the fabricated wafer during a die separation process, separating the die from the fabricated wafer while attached to the adhesive tape and removing the die from the adhesive tape.